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About This Webinar
This webinar will explore the challenges and breakthroughs in meeting the evolving bump requirements of advanced packaging technologies through optimized electrochemical deposition (ECD) plating processes. We will trace the industry's transition from flip chip to 3D stacking, focusing on the demand for smaller bump sizes and tighter pitches.

The session will explore the complexities of ECD processes for copper, nickel and tin (and their alloys), with particular emphasis on microbump development. Additionally, we will evaluate NiFe alloy as a superior diffusion barrier, presenting empirical data and experimental solutions to address the miniaturization challenges in advanced packaging, while highlighting the exceptional performance of NiFe as a barrier material.
Agenda
  • Welcome and introduction
  • Copper fine-pitch bump electrolyte: an overview of Spherolyte® Cu FP
  • Introducing a new diffusion barrier solution: Spherolyte® NiFe
  • Q&A session
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Dr. Jessica Stubbe
Global Application Manager Semiconductor ECD

Jessica started her career at MKS` Atotech as a scientist in the semiconductor department, where she developed expertise in electrochemical processes. She later advanced into a leadership position, now heading the electrochemical deposition team within the semiconductor division. In her current role, she oversees the management and optimization of application processes, driving the development of cutting-edge semiconductor technologies. Jessica earned her PhD in coordination chemistry from Freie Universität Berlin, where she focused on electrochemistry.
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