Differential etching reimagined: undercut-free anisotropic iron etching

With miniaturization in electronics comes the need for ever-shrinking line and space requirements. Existing differential etching methods are reaching their limits as mouse bites and shape changes have an increasingly negative impact on performance and yield. 

In this webinar, we will introduce you to a differential etch process specifically designed for SAP and ETS applications to cope with these challenges: EcoFlash® S300.

We will highlight how an anisotropic iron etchant enables fast etch rates while ensuring a rectangular conductor shape. This novel approach not only contributes to cost savings compared to the POR, but also proves more stable in high-volume manufacturing environments while leaving traces completely free of undercuts.

After outlining the problems of the status quo, we will introduce our novel mechanism and benchmark our process with competing methods.