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About This Webinar
The relentless miniaturization and increasing complexity of printed circuit boards (PCBs) demands ever-more sophisticated solutions for reliable signal transmission. A critical factor in achieving this is robust innerlayer bonding. During this webinar, we will give you an overview of BondFilm® EX, a revolutionary new adhesion promoter specifically designed to elevate PCB performance to unprecedented levels.

BondFilm EX tackles a major hurdle in high-performance PCB design – surface roughness. Roughness disrupts signal integrity, causing distortion and transmission loss. BondFilm EX addresses this challenge head-on by reducing the required roughness by three quarters and thus leaving a much smoother surface. This results in cleaner signal paths, minimizing signal degradation and ensuring flawless signal transmission across the PCB.

However, achieving smoothness often comes at the expense of bonding strength and thermal stability. Not with BondFilm EX. This innovative treatment employs a unique combination of mechanical and chemical bonding mechanisms. Its synergistic approach delivers exceptional adhesion between layers, surpassing the performance of conventional treatments. In addition, BondFilm EX offers outstanding thermal reliability, ensuring that PCBs can withstand the rigors of demanding operating environments.
Agenda
  • Introduction
  • Problem description
  • Solution options
  • BondFilm EX
  • Performance and benefits
  • Q&A session
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Christopher Seidemann
Global Product Manager Surface Treatment Technology

Holds an MBA comparable master's degree in entrepreneurial economics and management. He gained professional experience in process and quality management, project controlling and finally as an innovation consultant in various industries before taking the position of Global Product Manager STT at Atotech in 2021.
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