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About This Webinar
As technology advances, the demands on PCBs and wafers are increasing, driven by increased data traffic, EVs and the growing use of AI applications. On the one hand, we are seeing more complex and finer features (smaller L/S) in PCB technology, and on the other hand, PCB finishes are becoming more versatile and demanding. These trends are driving more complex and smaller features and higher reliability. PCB finishes need to be more versatile and durable.

During this webinar we will present our latest finish to ensure reliable performance even under extreme conditions. Aurotech® G-Bond 3 is our new universal gold solution for ENIG, ENEPIG and EPAG finishing. Sandra will explain why Aurotech® G-Bond 3 meets the latest industry requirements for performance and reliability. At the same time, its non-toxic stabilization and EDTA-free processing reduces the environmental impact. Performance data will demonstrate the technical capability of this process with its autocatalytic plating behavior.
Agenda
  • Introduction
  • Versatile high reliability gold solution: Aurotech® G-Bond 3
  • Performance and benefits
  • Q&A session
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Sandra Nelle
Global Assistant Product Manager Selective Finishing

Sandra has been in the PCB and IC packaging industry since 2015 when she began working for MKS` Atotech. After being an application engineer for two years she was promoted to Global Assistant Product Manager position for all Final Finishing processes. She holds a M.Sc. degree in Industrial Engineering in the field of chemistry and chemical engineering (TU Berlin).
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