Prepare for the future by learning to make your injection molding process more sustainable. Speakers will cover topics such as maximizing energy efficiency to reduce both cost and carbon footprint, recovering value with regrind operations, and managing recycled and bio-derived polymers. Join Plastics Technology and industry experts as we explore the challenge — and the opportunity — of sustainability in injection molding.
  • Energy management
  • Managing carbon footprint
  • PCR management/use
  • In-house recycling
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    Sales Director, ACS Group
    Joe Platek, sales director, has been with ACS Group for 14 years. He has over 17 years of technical sales experience and specializes in developing solutions for complex applications. In previous roles with ACS Group, he was an application engineer on the size reduction product line, a regional sales manager and a business development manager. Joe holds a bachelor's degree in mechanical engineering from Marquette University and an MBA from Louisiana State University from the Shreveport campus.
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    Sales Manager, Circular Economy - West; Vecoplan
    Doug began his industrial manufacturing career focusing on Mil Spec and NAS component groups with a focus on production and assembly applications. Moving forward, his focus concentrated in the field of CNC applications, fixturing and tooling. He has extensive knowledge across various industries. For the past three years, he has been focused on customized machine applications in the plastics recycling industry, currently focusing on the resizing of both post-industrial and post-consumer applications.
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    Applications Engineer, Vecoplan
    Nick Williams is the applications engineer at Vecoplan North America, bringing extensive expertise to his role. He holds a bachelor's degree in engineering from NC State University and has been a key member of the Vecoplan team since 2016. Nick began his career with the company as a project engineer before transitioning to applications engineer in early 2024. Throughout his tenure, he has developed deep knowledge in size-reduction technologies and system integrations.
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