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About
The need for speed is the relentless driver for every higher data rate system. Each new advance in data rate and signal bandwidth brings with it a new set of challenges in interconnect and I/O transceiver technologies as well as the picks and shovels that enable shorter time to market ever more advanced systems. This panel discussion brings together experts in the industry to present solutions to the most difficult design and system challenges when migrating products from the 56 Gbps or 112 Gbps range into the 224 Gbps range. This panel is moderated by Prof Eric Bogatin.
Presenters
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Eric Bogatin
Professor, University of Colorado Boulder
Eric Bogatin is currently a Professor in the ECEE dept at University of Colorado, Boulder, where he teaches courses on PCB design, signal integrity and systems engineering. He is also the technical editor of the Signal Integrity Journal and a Fellow at Teledyne LeCroy. Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. He has written 15 technical books in the field and presented classes and lectures on signal integrity worldwide.
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Scott McMorrow
Strategic Technologist at Samtec, Inc.
Scott McMorrow currently serves as Strategic Technologist for Samtec’s Signal Integrity Group. As a consultant for years too numerous to mention, Scott has helped many companies develop high performance products, while training signal integrity engineers. McMorrow started Samtec’s webinar series gEEk® spEEk, providing virtual engineering learning. McMorrow also works on Samtec’s twinax technology, pushes EDA companies to focus on signal integrity, developed advanced crosstalk analysis, and power delivery methodology. Scott has been "at the forefront of PCBA Signal Integrity and Power Integrity engineering for more than 30 years."
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Todd Bermensolo
Principal Engineer at Alphawave Semi
Todd Bermensolo is a Principal Engineer at Alphawave Semi, in their Product Marketing team. He has previously worked as an Application Engineer at Keysight Technologies and as a member of the Enterprise Platform Signal Integrity team at Intel Corporation. Todd received his BS degree in EE from University of Idaho in 1998 and his MS degree in EE from University of Illinois in 2005.
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Jason J Ellison
Principal Signal Integrity Technologist, Rohde and Schwarz
Jason J Ellison is Principal Signal Integrity Technologist Rohde and Schwarz. He received his Master of Science in Electrical Engineering from Penn State University in December 2017. He is employed as a signal integrity engineer and develops high-speed interconnects, lab automation technology, and calibration technology. His interests are signal integrity, power integrity and embedded system design. He also writes technical publications for journals such as “The Signal Integrity Journal”. Mr. Ellison is an active IEEE member and a DesignCon technical program committee member.
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