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Fujipoly- Understanding Thermal Gap Filler Pads, PCB Deflection and Stress
About This Webinar
Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, Fujipoly will look at the compression characteristics of thermal gap filler pads and apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCBs.
Who can view: Everyone
Webinar Price: Free
Featured Presenters
Sales Engineer
Ed Morris is a Sales Engineer with Win Cor Electronic Sales Corp and has over 15 years experience working with a variety of electro-mechanical products. Ed has received his Bachelor of Science Degree at Delaware Valley University and has done Masters work at LaSalle University.
National Sales Manager
James Hopkins is the National Sales Manager with Fujipoly and has been with the company 10 years. He received his Bachelor of Science Degree from Bloomfield College and Master's Degree from College of Saint Elizabeth
Applications Engineer
Christian Mainegra is an Applications Engineer at Fujipoly and has been with the company for 9 years. He recieved his Bachelor of Science Degree in Mechanical Engineering from New Jersey Institute of Technolog and his Master's Degree from Steven's Institute of Technology
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