Advanced electroless palladium PD-Core®, our new high-volume economical plating solution

Electroless palladium plating finds its application in the plating of ENEPIG (Electroless nickel/electroless palladium/immersion gold) or EPAG. But although those finishes offer multiple benefits with wide soldering and bonding capabilities a major concern in the industry is related to the cost of the precious metal.

In this webinar we will introduce PD-Core®, a new electroless plating electrolyte that was developed with the target, to reduce the process cost. It allows to operate the process with lower palladium content, longer bath life and higher process robustness and is capable to plate on Nickel and Copper directly. Performance data as well as consumption data and cost savings of the process in high-volume manufacturing will be shared and compared with the conventional Pd-plating process.