About

In this presentation (titled Design Guidance Essentials for Thick Film Circuits in RF & Microelectronics Applications), Chandra Gupta will delve into key design principles and best practices for developing robust thick film circuits. These circuits -- whether configured as single substrates, complex assemblies, or high-density multilayer solutions – can be pivotal assets in applications where performance, reliability and cost are paramount. This presentation will cover design considerations and practical implementations in thick film ceramic boards, such as Alumina, Aluminum Nitride and Beryllium Oxide. Incorporation of resistors, RF hybrids, filters and other structures. Chandra will next address critical challenges posed by the environmental conditions at the board level and provide insights that help ensure performance and durability. Finally, the presentation will also emphasize the importance of achieving high repeatability and consistency in the manufacturing process and touch on applicable industry standards. Attendees will gain valuable knowledge to enhance the design and production of thick film circuits for demanding RF and microelectronics applications.



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Presenter
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Chandra Gupta
Business Development Manager, Remtec, Inc.
Chandra Gupta is the Business Development Manager for Remtec, Inc., where he has been contributing his extensive electronics industry expertise since 2023. With over 35 years of industry experience, Chandra has held significant roles at prominent companies such as Mini-Circuits, Communications & Power Industries, Inc., Analog Devices, Inc. (formerly Hittite Microwave Corp), and Aeroflex (now part of Cobham). His academic background includes a Bachelor of Science and a PhD from the University of Wales in Bangor, United Kingdom, as well as an MBA from Rutgers University. Throughout his career, Chandra has demonstrated a consistent ability to drive business growth and innovation in the technology sector.
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