Revolutionary bonding processes for high-speed signal transmission
About This Webinar
Stay ahead in the rapidly evolving electronics industry, where the demand for high-speed signal propagation continues to grow. Traditional methods of enhancing adhesion between conductors and dielectrics by increasing surface roughness are no longer sufficient. In this webinar, we will introduce our latest innovation in adhesion promotion systems, specifically designed to address the challenges of high-speed PCBs. By leveraging chemical bonding, we enhance adhesion while maintaining ultra-low surface roughness—crucial for high-performance applications.
Our cutting-edge adhesion promoter system represents a major breakthrough, setting a new standard for performance and sustainability in PCB processing for ultra-high-speed electronics. This solution positions us as a leader in modern electronics manufacturing, delivering the next generation of high-performance technology.
Agenda
Introduction
Technological roadmap: exploring the future trends and innovations in PCB processing
Bonding solutions for high-speed applications: addressing the challenges of high-speed signal propagation
Introducing NovaBond PX-S2: our latest breakthrough in adhesion promotion technology
Q&A session
Dr. Thomas Thomas
Global Product Manager Surface Treatment
Joined MKS’ Atotech in 2014, initially in the role of R&D Scientist. In 2019 Dr. Thomas was appointed as Global Product Manager for Surface Treatment Technology product team.