In this presentation (titled Design Guidance Essentials for Thick Film Circuits in RF & Microelectronics Applications), Chandra Gupta will delve into key design principles and best practices for developing robust thick film circuits. These circuits -- whether configured as single substrates, complex assemblies, or high-density multilayer solutions – can be pivotal assets in applications where performance, reliability and cost are paramount. This presentation will cover design considerations and practical implementations in thick film ceramic boards, such as Alumina, Aluminum Nitride and Beryllium Oxide. Incorporation of resistors, RF hybrids, filters and other structures. Chandra will next address critical challenges posed by the environmental conditions at the board level and provide insights that help ensure performance and durability. Finally, the presentation will also emphasize the importance of achieving high repeatability and consistency in the manufacturing process and touch on applicable industry standards. Attendees will gain valuable knowledge to enhance the design and production of thick film circuits for demanding RF and microelectronics applications.

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